99 Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting

Alumina Ceramic Substrate Effective Heat Dissipation And Dimensional Stability For Power Electronics And LED Lighting

Alumina ceramic substrate (Al₂O₃ ceramic substrate) is an electronic ceramic material composed of 96%-99.9% aluminum oxide, offering excellent insulation properties, high thermal conductivity and good mechanical strength. As a crucial carrier for electronic components, it is widely used in power electronics, LED packaging, integrated circuits and other fields. Its unique properties make it an indispensable fundamental material for modern electronic devices.

Main Applications

• Power Electronics: IGBT module substrates, MOSFET heat dissipation substrates

• LED Lighting: COB packaging substrates, high-power LED carriers

• Integrated Circuits: Thick film circuit substrates, thin film circuit carriers

• Sensors: Pressure sensor substrates, temperature sensing elements

• Microwave Communication: RF device substrates, antenna array base materials

Core Advantages

★ Superior Insulation: Dielectric strength >15kV/mm, volume resistivity >10¹⁴Ω·cm
★ Excellent Thermal Conductivity: 20-30W/(m·K) thermal conductivity for effective heat dissipation
★ High Strength & Durability: Flexural strength >300MPa, Mohs hardness 9
★ Dimensional Stability: CTE 7-8×10⁻⁶/℃ matching semiconductor materials
★ Environmental Resistance: High temperature, corrosion and aging resistance

Technical Specifications

Manufacturing Process

1. Powder Preparation: Fine grinding of high-purity alumina powder

2. Tape Casting: Precision thickness control ±1%

3. High-Temperature Sintering: 1600-1700℃ atmosphere protection sintering

4. Laser Cutting: Precision ±0.02mm

5. Surface Treatment: Double-side polishing to Ra0.1μm

6. Strict Testing: 100% electrical performance testing

Usage Guidelines

1. Recommended soldering temperature below 850℃

2. Avoid mechanical impact and local stress concentration

3. Storage environment humidity <60%RH

4. Consider thermal expansion matching when assembling with metal parts

5. Surface metallization recommended for high-frequency applications

After-Sales Service Commitment

• Professional technical support and selection guidance

• 48-hour rapid response mechanism

• Small batch samples available (MOQ 50pcs)

• Third-party test reports provided (SGS/CNAS)

FAQ

Q: How to choose different alumina contents?
A: 96% for conventional electronics; 99% for high thermal conductivity needs; 99.6% for high-frequency precision circuits

Q: What is the maximum processable size?
A: Standard size 150×150mm, maximum up to 200×200mm

Q: Are special shapes supported?
A: Laser precision cutting service available, minimum hole diameter 0.1mm

Q: What metallization options are available?
A: Various solutions including gold plating, silver plating, and copper plating