High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation And Superior Insulation

High-Power Electronic Devices Alumina Ceramic Substrates with Heat Dissipation and Superior Insulation

Product Introduction

Our alumina ceramic insulation heat sink substrates are manufactured from 99.6% high-purity alumina material, specifically engineered for thermal management and electrical insulation requirements in high-power electronic devices. Featuring excellent thermal conductivity (24-30W/(m·K)) and ultra-high insulation strength (>15kV/mm), with precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates represent the ideal solution for high-temperature, high-power applications including power semiconductors, LEDs, and IGBT modules.

Primary Applications

• Power Electronics: IGBT modules, MOSFETs, thyristor heat sinks

• LED Lighting: High-power LED chip packaging substrates

• New Energy Vehicles: Motor controllers, charging pile power modules

• 5G Communications: Base station power amplifier heat sinks

• Industrial Control: Frequency converters, servo drive power units

Key Advantages

⚡ Efficient Heat Dissipation: Thermal conductivity up to 30W/(m·K), 10× better than standard PCBs
⚡ Superior Insulation: Breakdown voltage >15kV/mm, volume resistivity >10¹⁴Ω·cm
⚡ High-Temperature Resistance: Continuous operation up to 850°C
⚡ Dimensional Stability: CTE 7.2×10⁻⁶/℃, excellent match with chips
⚡ Precision Machining: Flatness ≤0.02mm/50mm, laser-cuttable

Technical Specifications

Precision Manufacturing Process

1. Powder Preparation: High-purity alumina powder (D50≤0.8μm)

2. Tape Casting: Precise slurry viscosity and thickness control

3. Isostatic Pressing: 200MPa high-pressure densification

4. Atmosphere Sintering: 1650°C hydrogen-protected sintering

5. Precision Machining: Double-side grinding + laser cutting

6. Surface Treatment: CMP polishing to Ra 0.1μm

7. Full Inspection: AOI + insulation testing

Installation Guidelines

⚠ Professional Recommendations:

• Soldering temperature <280°C, duration <10 seconds

• Apply thermal grease to enhance thermal contact

• Avoid mechanical impact and localized stress concentration

• Storage humidity <60% RH

• Recommend regular insulation checks (every 5,000 hours)

Service Commitment

• Technical Support: Thermal simulation analysis services

• Rapid Response: 48-hour expedited delivery for standard sizes

• Customization: Special shapes and metallization treatments available

• Failure Analysis: SEM+EDS testing laboratory equipped

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is double-side metallization possible?
A: Supports thick-film printing, thin-film sputtering, DBC and other metallization processes

Q: How to ensure reliability in vibration environments?
A: Recommend our patented edge reinforcement structure design