High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness

High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness

Product Introduction

Alumina ceramic substrates are electronic ceramic base plates manufactured from high-purity alumina (Al₂O₃ content 96%-99.9%), featuring excellent insulation properties, high thermal conductivity and low dielectric loss. With precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates are ideal for high-end applications including power electronic devices, LED packaging, and semiconductor modules.

Primary Applications

• Power Electronics: IGBT module substrates, power MOSFET heat dissipation bases

• LED Lighting: High-power LED chip packaging substrates

• Semiconductors: RF/microwave circuit substrates, MEMS device carriers

• Automotive Electronics: New energy vehicle electronic control system heat sinks

• 5G Communications: Base station power amplifier heat dissipation substrates

Key Advantages

✅ High Thermal Conductivity: 24-30W/(m·K), 10× better than standard PCB materials
✅ Superior Insulation: Volume resistivity >10¹⁴Ω·cm
✅ Low Thermal Expansion: 7.2×10⁻⁶/℃, excellent match with silicon wafers
✅ High-Temperature Resistance: Continuous operation up to 850℃
✅ Exceptional Flatness: ≤0.02mm/50mm surface flatness

Technical Specifications

Manufacturing Process

1. Powder Preparation: High-purity alumina powder (D50≤1μm)

2. Tape Casting: Precise slurry viscosity and thickness control

3. Isostatic Pressing: 200MPa high-pressure densification

4. High-Temp Sintering: 1600℃ atmosphere-protected sintering

5. Precision Machining: Double-side grinding + laser cutting

6. Surface Treatment: Chemical mechanical polishing (CMP)

7. Full Inspection: Automated optical inspection (AOI)

Usage Guidelines

⚠ Installation Notes:

• Recommended soldering temperature <300℃

• Avoid mechanical impact and localized stress concentration

• Storage humidity should be <60% RH

• Consider CTE matching when assembling with other materials

• Recommend using silver paste or AuSn solder for mounting

Service Commitment

• Technical Support: Thermal simulation analysis services

• Rapid Response: 72-hour expedited delivery for standard sizes

• Customization: Special shapes and metallization treatments available

• Failure Analysis: Equipped with SEM+EDS testing equipment

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is multilayer wiring possible?
A: LTCC multilayer co-fired substrate solutions available

Q: What metallization options exist?
A: Supports thick-film printing, thin-film sputtering, DBC and other processes