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Silicon Carbide Ceramics Superior Optical Properties and Thermal Shock Resistance for High-Performance Applications

Product Details

Place of Origin: Made In China

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si3n4 high purity silicon carbide

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ceramic silicon high thermal conductivity

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si3n4 carbide ceramic

Bending Strength:
380 MPa
Content:
99% SIC
Modulus Of Elasticity:
420 Gpa
Application:
Industrial Ceramic
Quality Control:
100% Inspection
Feature:
High Temperature Resistance
Corrosion Resistance:
Excellent
Free Silicon Content:
≤10%
Color:
Black
Working Temperature:
1400℃
Dielectric Constant:
9.7
Wear Resistance:
Excellent
Chemical Inertness:
High
Thermal Conductivity:
120-200 W/mK
Elastic Modulus:
320GPa
Bending Strength:
380 MPa
Content:
99% SIC
Modulus Of Elasticity:
420 Gpa
Application:
Industrial Ceramic
Quality Control:
100% Inspection
Feature:
High Temperature Resistance
Corrosion Resistance:
Excellent
Free Silicon Content:
≤10%
Color:
Black
Working Temperature:
1400℃
Dielectric Constant:
9.7
Wear Resistance:
Excellent
Chemical Inertness:
High
Thermal Conductivity:
120-200 W/mK
Elastic Modulus:
320GPa
Silicon Carbide Ceramics Superior Optical Properties and Thermal Shock Resistance for High-Performance Applications

Hexagonal Silicon Carbide Ceramic Plate - High-Strength & Modular Design

Product Overview

This industrial-grade silicon carbide ceramic plate features a precision-engineered hexagonal structure manufactured through advanced pressureless sintering. Characterized by its distinctive dark-gray hue and dense molecular structure, the plate boasts a uniform matte-finish surface that ensures optimal performance in demanding applications. The monolithic construction with precision-chamfered edges enables seamless modular assembly while eliminating structural weaknesses.

Key Features

  • Superior Wear Resistance: Surface hardness exceeding HRA92, delivering 10x longer service life than conventional tool steel

  • High-Temperature Endurance: Maintains structural integrity and dimensional stability at continuous operating temperatures up to 1450°C

  • Advanced Thermal Management: Exceptional thermal conductivity (130 W/m·K) coupled with reliable electrical insulation

  • Chemical Resilience: Excellent resistance to acidic and alkaline environments, ensuring longevity in corrosive applications

  • Modular Configuration: Geometric design allows for seamless tiling and flexible layout configurations

Application Scenarios

  • Semiconductor Processing: Diffusion furnace carriers, wafer handling fixtures, vacuum chamber components

  • Energy Systems: Fuel cell separators, photovoltaic processing plates, battery production molds

  • Precision Manufacturing: Coordinate measuring machine platforms, linear motion guide components

  • Thermal Processing: Kiln furniture systems, heat treatment fixtures, high-temperature conveyor segments

  • Electronics Thermal Management: Power electronics substrates, RF microwave components

Technical Specifications

 
 
Parameter Value
Material Composition Pressureless Sintered SiC
Configuration Regular Hexagonal Plate
Bulk Density ≥3.14 g/cm³
Hardness Scale HRA92-94
Compressive Strength ≥2200 MPa
Maximum Service Temperature 1450°C (air atmosphere)
Thermal Conductivity 125-135 W/(m·K)
Surface Texture Ra 0.4-0.8 μm

Manufacturing Process

Raw material purification → Formula optimization → Granulation → Biaxial pressing → Sintering cycle → Multi-surface grinding → Edge profiling → Ultrasonic cleaning → Dimensional verification → Quality certification

Installation Guidelines

  1. Prepare mounting surfaces to achieve contamination-free conditions

  2. Maintain 0.5-1.0mm inter-plate spacing to accommodate thermal expansion

  3. Utilize specialized installation tools to prevent mechanical impact damage

  4. Implement regular inspection protocols for connection integrity

  5. Perform cleaning procedures using approved non-abrasive materials

Service Commitment

  • 24-month product warranty with comprehensive technical support

  • Lifetime application engineering consultation

  • On-site installation supervision available

  • Emergency replacement service for qualified claims

Technical Q&A

Q: What dimensional tolerance can be achieved for modular assembly?
A: Our CNC grinding process ensures assembly gaps under 0.2mm with superior surface coplanarity.

Q: Are these plates suitable for ultra-high vacuum environments?
A: Yes, the low outgassing rate meets vacuum system requirements for semiconductor and research applications.

Q: Do you provide custom geometric configurations?
A: We offer comprehensive customization services including size modifications and special geometric requirements.

Q: How does thermal performance compare with aluminum nitride?
A: While maintaining better mechanical strength, our SiC plates provide 85% of AlN's thermal conductivity at 60% of the cost.

 

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