High-Temperature Resistance Ceramic Nozzles for 1200 deg C Process Temperatures in LED Industry

High-Temperature Resistance Ceramic Nozzles for 1200 deg C Process Temperatures in LED Industry

Specially developed for LED manufacturing processes, this product is manufactured using 99.8% high-purity silicon nitride (Si₃N₄) through precision gas pressure sintering. Featuring ultra-high cleanliness, high-temperature resistance, and corrosion resistance to meet stringent MOCVD equipment requirements.

LED Manufacturing Applications

• MOCVD equipment: Precise distribution of MO source and NH₃ gas

• Epitaxial growth: Uniform gas injection in reaction chambers

• Chip fabrication: Protective gas delivery systems

• Packaging process: Phosphor spray atomization

• Testing equipment: Optical inspection gas control

LED Industry Advantages

✓ Ultra-high cleanliness: Metal ion content <1ppm
✓ High-temperature resistance: Withstands 1200°C process temperatures
✓ Zero gas contamination: No particulate emission
✓ Precise flow control: ±1% flow accuracy
✓ Extended lifespan: Endures 5000+ thermal cycles

LED-Specific Parameters

Clean Manufacturing Process

1. Material preparation:

   • Nano powder (D50≤0.3μm)

   • Dust-free ball milling (Class 10 cleanroom)

2. Forming and sintering:

   • Isostatic pressing (200MPa)

   • Ultra-clean sintering (Class 100 environment)

3. Post-processing:

   • Plasma cleaning (surface decontamination)

   • Ultrasonic DI water cleaning

4. Packaging:

   • Double vacuum packaging

   • ISO Class 4 clean bags

Usage Guidelines

⚠️ Installation: Class 100 cleanroom operation required
⚠️ Gas control: Use 99.999% high-purity gases
⚠️ Temperature management: Heating rate ≤5℃/min
⚠️ Maintenance: Helium leak test every 500 hours

Specialized Services

• Extended warranty: 18 months

• Cleanliness testing: Free particle emission test

• Rapid response: 12-hour technical support

• Process optimization: Gas flow field simulation

FAQ

Q: How to ensure MO source delivery purity?
A: Triple safeguards:
① Surface Si passivation
② Class 100 clean packaging
③ Pre-installation plasma cleaning

Q: Handling nozzle clogging?
A: Recommended:
• 200W ultrasonic + DI water cleaning
• No mechanical rod cleaning
• Professional cleaning service available

Q: Compatibility with different epitaxial layers?
A: Customizable options:

• Multi-hole array structures

• Gradual bore size designs

• Special angle configurations

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