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Home > products > Silicon Nitride Ceramics > Silicon Nitride Ceramic Open-Mesh Structure: Lightweight Engineering Solution For Extreme Environments

Silicon Nitride Ceramic Open-Mesh Structure: Lightweight Engineering Solution For Extreme Environments

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Place of Origin: Made In China

Brand Name: Dayoo

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Highlight:

electrical conductivity ceramic nitride

,

ceramic nitride high hardness

,

high hardness silicon carbide nitride

Features:
Wear-resistant/insulation
Thermal Conductivity:
30 W/mK
Type:
Ceramic Parts
Quality Control:
100% Inspection
Chemical Inertness:
High
High Temperature Resistance:
1200°C
Melting Point:
1900°C
Dielectric Strength:
18-20 KV/mm
Electrical Insulation:
Yes
Processing Service:
Cutting, Punching, Moulding
Flexural Strength:
400-600 MPa
Wear Resistance:
Excellent
Shape:
Customerized
Temperature Range:
Up To 1,400°C
High Temperature Strength:
Excellent
Features:
Wear-resistant/insulation
Thermal Conductivity:
30 W/mK
Type:
Ceramic Parts
Quality Control:
100% Inspection
Chemical Inertness:
High
High Temperature Resistance:
1200°C
Melting Point:
1900°C
Dielectric Strength:
18-20 KV/mm
Electrical Insulation:
Yes
Processing Service:
Cutting, Punching, Moulding
Flexural Strength:
400-600 MPa
Wear Resistance:
Excellent
Shape:
Customerized
Temperature Range:
Up To 1,400°C
High Temperature Strength:
Excellent
Silicon Nitride Ceramic Open-Mesh Structure: Lightweight Engineering Solution For Extreme Environments

Silicon Nitride Ceramic Open-Mesh Structure: Lightweight Engineering Solution For Extreme Environments

Introduction

The silicon nitride ceramic open-mesh structure is a porous, lightweight ceramic component manufactured through advanced forming and sintering technologies. It combines the inherent properties of silicon nitride—high strength, high-temperature resistance, and corrosion resistance—with the benefits of mesh design, including light weight, high specific surface area, and functional versatility. This structure excels in extreme environments involving high temperatures, strong corrosion, or high mechanical loads, making it an ideal choice for high-end industrial applications.


Applications

  • High-Temperature Furnace Trays: Used in semiconductor sintering furnaces and vacuum heat treatment equipment to support workpieces. Resists high temperatures, maintains shape stability, and avoids contamination of the process environment.

  • Lightweight Structural Components for Precision Machinery: Serves as functional parts such as robotic arms and aerospace support frames requiring high stiffness and low weight.

  • Heat Exchange System Components: Used in gas turbines and electronic cooling modules to enhance heat transfer efficiency thanks to high thermal conductivity and large surface area.

  • Filtration and Diffusion Media: Acts as filter plates or gas distribution components in high-temperature corrosive gas or molten metal environments.


Advantages

  • Extreme Environment Stability: Maintains structural integrity at temperatures up to 1200°C, with excellent thermal shock resistance and resistance to acids and alkalis.

  • High Specific Strength and Stiffness: Low density (~3.2 g/cm³) and high strength make it ideal for lightweight designs.

  • Flexible Functional Design: Customizable pore size, shape, and porosity to meet heat dissipation, filtration, or load-bearing requirements.

  • Long Service Life and Low Maintenance: Outperforms metal alloys in continuous operation due to wear resistance, creep resistance, and corrosion resistance.


Technical Specifications

 
 
Property Unit Typical Range Test Standard
Porosity % 20-60 (Customizable) ASTM C20
Compressive Strength MPa 50-200 ASTM C773
Max Service Temperature °C (in air) 1200 -
Coefficient of Thermal Expansion ×10⁻⁶/°C 3.0-3.3 ASTM E228
Thermal Conductivity W/(m·K) 25-35 ASTM E1461
Density g/cm³ 2.0-2.8 Archimedes Method

Manufacturing Process

  1. Powder Preparation: Mixing high-purity silicon nitride powder with sintering aids.

  2. Forming: Creating green open-mesh structures via injection molding, 3D printing, or gel casting.

  3. Debinding and Sintering: Removing binders in a controlled temperature furnace, followed by densification via gas pressure sintering.

  4. Machining and Inspection: Precision CNC machining, non-destructive testing, and dimensional inspection.


Usage Guidelines

  • Installation: Avoid impact from sharp tools on mesh edges; handle with care.

  • Operating Conditions: Ensure compatibility of temperature and media with ceramic material (e.g., avoid hydrofluoric acid environments).

  • Cleaning: Use ultrasonic cleaning or alcohol wiping; avoid acid or alkali immersion.


Support & Services

  • 12-month quality warranty and lifetime technical consultation.

  • Customization and application-specific design services available.

  • Failure analysis and optimization solutions for damaged components.


FAQ

  • Q: Does the open-mesh structure reduce overall strength?
    A: A properly designed mesh structure maintains high specific strength while achieving lightweight goals. Finite element analysis can optimize stress distribution.

  • Q: Can it be used in oxidizing atmospheres?
    A: Silicon nitride can withstand temperatures up to 1200°C in air for extended periods. Higher temperatures require protective coatings to prevent surface oxidation.

  • Q: Are complex shapes customizable?
    A: Yes, complex shapes can be achieved via 3D printing or custom molds, with minimum pore sizes as small as 0.5 mm.

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Silicon Nitride Ceramic Open-Mesh Structure: Lightweight Engineering Solution For Extreme Environments 0