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High-Purity Alumina Ceramic Parts for Industrial Applications

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Type:	Alumina Ceramic Parts	Material:	Alumina
Application:	Industrial Ceramic	Properties:	Electric Insulation
Thermal Expansion Coefficient:	8.5 X 10^-6 /K	Chemical Resistance:	Excellent
Wear Resistance:	Excellent	Mechanical Strength:	High
Size:	Customized	Dielectric Constant:	9.8
Purity:	96%,99%	Dielectric Strength:	14 KV/mm
Applications:	High Temperature And High Voltage Electrical Insulators, Wear-resistant Components, Cutting Tools, Biomedical Implants	Corrosion Resistance:	Excellent
Maximum Use Temperature:	1600°C	Shape:	Cylinder
Flexural Strength:	350 MPa	Thermal Conductivity:	35 W/mK
Elastic Modulus:	380 GPa	Materials:	92% Alumina Powder
Dimensional Tolerance:	±0.001 Mm	Transparency:	Opaque
Density:	3.9 G/cm3	Melting Point:	2040°C
Hardness:	9 Mohs	Compressive Strength:	2000 MPa

Type:	Alumina Ceramic Parts
Material:	Alumina
Application:	Industrial Ceramic
Properties:	Electric Insulation
Thermal Expansion Coefficient:	8.5 X 10^-6 /K
Chemical Resistance:	Excellent
Wear Resistance:	Excellent
Mechanical Strength:	High
Size:	Customized
Dielectric Constant:	9.8
Purity:	96%,99%
Dielectric Strength:	14 KV/mm
Applications:	High Temperature And High Voltage Electrical Insulators, Wear-resistant Components, Cutting Tools, Biomedical Implants
Corrosion Resistance:	Excellent
Maximum Use Temperature:	1600°C
Shape:	Cylinder
Flexural Strength:	350 MPa
Thermal Conductivity:	35 W/mK
Elastic Modulus:	380 GPa
Materials:	92% Alumina Powder
Dimensional Tolerance:	±0.001 Mm
Transparency:	Opaque
Density:	3.9 G/cm3
Melting Point:	2040°C
Hardness:	9 Mohs
Compressive Strength:	2000 MPa

High-Purity Alumina Ceramic Parts for Industrial Applications

Alumina Ceramic - Premium Industrial Material with Exceptional Chemical Resistance

Product Specifications

Attribute	Value
Type	Alumina Ceramic Parts
Material	Alumina
Application	Industrial Ceramic
Properties	Electric insulation
Thermal Expansion Coefficient	8.5 x 10^-6 /K
Chemical Resistance	Excellent
Wear Resistance	Excellent
Mechanical Strength	High
Size	Customized
Dielectric Constant	9.8
Purity	96%, 99%
Dielectric Strength	14 kV/mm
Applications	High temperature and high voltage electrical insulators, wear-resistant components, cutting tools, biomedical implants
Corrosion Resistance	Excellent
Maximum Use Temperature	1600°C
Shape	Cylinder
Flexural Strength	350 MPa
Thermal Conductivity	35 W/mK
Elastic Modulus	380 GPa
Materials	92% Alumina Powder
Dimensional Tolerance	±0.001 mm
Transparency	Opaque
Density	3.9 g/cm³
Melting Point	2040°C
Hardness	9 Mohs
Compressive Strength	2000 MPa

Manufacturing Process

Our high-performance alumina ceramic is produced through precise engineering and controlled processes to achieve optimal purity, density, and microstructure:

Powder Preparation
- High-purity Al₂O₃ powder (typically 99.5%+ purity) synthesized via Bayer process or chemical precipitation
- Optimized particle size distribution (submicron to a few microns) to enhance sintering activity
Forming Techniques
- Dry Pressing: Suitable for simple shapes; powder compacted under high pressure (50-200 MPa)
- Isostatic Pressing (CIP/HIP): Uniform compaction for complex geometries using hydrostatic pressure
- Injection Molding: For intricate parts; Al₂O₃ powder mixed with binders, molded, and debound
- Slip Casting: Used for thin-walled components; aqueous slurry poured into porous molds
Sintering
- Fired at 1500-1800°C (depending on purity) in air or controlled atmospheres
- Densification occurs via solid-state diffusion, achieving >98% theoretical density
- Grain growth is carefully managed to balance strength and toughness
Post-Processing
- Precision machining (laser cutting, grinding) for tight tolerances
- Surface treatments (polishing, coating) to enhance functionality

Advanced manufacturing variants include:

Hot Pressing (HP) or Spark Plasma Sintering (SPS) for nanocrystalline structures
Additive Manufacturing: Emerging technology for customized ceramic components

This rigorous production process ensures our alumina ceramics meet the most demanding applications in aerospace, semiconductors, and biomedical fields.

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