Advanced Sintering Technology And Precise Atmosphere Control For Ceramic Nozzles In Semiconductor And Energy Industries

Advanced Sintering Technology And Precise Atmosphere Control For Ceramic Nozzles In Semiconductor And Energy Industries

This product is manufactured using 99.6% high-purity silicon nitride (Si₃N₄) material through precisely controlled sintering processes. Utilizing multi-stage gradient sintering curves and precise atmosphere control technology to ensure optimal microstructure and performance.

Primary Applications

• Aircraft engines: High-temperature fuel injection systems

• Energy equipment: Gas turbine combustion chambers

• Industrial spraying: HVOF (High-Velocity Oxygen Fuel) spraying

• 3D printing: Metal powder atomization devices

• Semiconductor: Wafer cleaning equipment

Sintering Process Advantages

✓ Precise temperature control: ±3℃ furnace uniformity
✓ Accurate atmosphere: Nitrogen protection with ≤5ppm oxygen
✓ Optimized gradient: 12-segment programmable heating curve
✓ Grain boundary control: Optimal grain boundary phase composition
✓ Density assurance: Relative density ≥99.5%

Technical Specifications

Sintering Process Flow

1. Debinding stage:

   • Temperature: Below 600℃

   • Atmosphere: Flowing nitrogen

   • Duration: 12-16h

2. Presintering stage:

   • Temperature: 1200-1500℃

   • Heating rate: 3℃/min

   • Soaking: 2h

3. High-temperature sintering:

   • Temperature: 1850℃

   • Atmosphere: High-pressure nitrogen (10MPa)

   • Soaking: 4h

4. Cooling control:

   • Rate: 2-3℃/min (above 1000℃)

   • Protection: Continuous nitrogen flow

Usage Guidelines

⚠️ Installation: Use ceramic-specific tools
⚠️ Temperature limit: Continuous use ≤1600℃
⚠️ Pressure limit: Working pressure ≤80MPa
⚠️ Media restriction: Avoid HF environment

After-Sales Service

• Technical support: Free sintering process consultation

• Customization: Special sintering curve development

• Emergency response: 24-hour technical support

FAQ

Q: Effect of sintering temperature deviation?
A: Minimal impact within ±5℃, significant strength reduction beyond ±10℃.

Q: How to ensure batch consistency?
A: Digital sintering curve traceability system.

Q: Sintering control for special shapes?
A: Custom molds and support systems available.